US Patent Issued to Skyworks Solutions on Aug. 26 for "Acoustic wave device with multi-layer piezoelectric substrate with heat dissipation" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,401,340, issued on Aug. 26, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Acoustic wave device with multi-layer piezoelectric substrate with heat dissipation" was invented by Keiichi Maki (Suita, Japan), Rei Goto (Osaka, Japan), Gong Bin Tang (Moriguchi, Japan) and Yosuke Hamaoka (Suita, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of this disclosure relate to a filter that includes an acoustic wave device with a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate (e.g., a quartz substrate), a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer,...