US Patent Issued to Skyworks Solutions on Aug. 12 for "Flip-chip semiconductor-on-insulator transistor layout" (California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,020, issued on Aug. 12, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Flip-chip semiconductor-on-insulator transistor layout" was invented by Yang Liu (Irvine, Calif.), Yong Hee Lee (Tustin, Calif.) and Thomas Obkircher (Santa Ana, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flip-chip semiconductor-on-insulator die includes a substrate layer, an active layer, an insulator layer between the substrate layer and the active layer, a first metal layer, and a first via layer between the active layer and the first metal layer. The die at least first and second contact pads and a transistor including a first terminal formed within t...