US Patent Issued to Skyworks Solutions on April 8 for "Co-located microelectromechanical system microphone and sensor with minimal acoustic coupling" (Singaporean, American Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,680, issued on April 8, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Co-located microelectromechanical system microphone and sensor with minimal acoustic coupling" was invented by Humberto Campanella-Pineda (Singapore), Michael Jon Wurtz (Lake Oswego, Ore.), You Qian (Singapore), Guofeng Chen (Fremont, Calif.) and Rakesh Kumar (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device package comprises a primary microphone having a frequency response having a first resonance frequency, and a reference microphone having a frequency response including a second resonance frequency, the primary microphone and the refere...