US Patent Issued to Skyworks Global on Sept. 2 for "Piezoelectric MEMS device with thermal compensation from different material thicknesses" (Japanese, South Korean Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,404,167, issued on Sept. 2, was assigned to Skyworks Global Pte. Ltd. (Singapore).

"Piezoelectric MEMS device with thermal compensation from different material thicknesses" was invented by Siarhei Dmitrievich Barsukou (Takarazuka, Japan), Myeong Gweon Gu (Seoul, South Korea) and Hiroyuki Nakamura (Osaka-Fu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A piezoelectric microelectromechanical systems device can include a cavity bounded by walls and an asymmetrical bimorph structure at least partially spanning the cavity that includes at least a piezoelectric layer and two electrode layers. The electrode layers can have relative thicknesses configur...