ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,612, issued on Sept. 9, was assigned to SKY TECH INC. (Hsinchu County, Taiwan).
"Bonding method and apparatus of substrates" was invented by Jung-Hua Chang (Hsinchu County, Taiwan) and Pei-Yun Chiang (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding method of substrates for bonding a first substrate and a second substrate. The method includes: placing the first substrate on a holding surface of a holder in a confined chamber; evacuating air from the confined chamber to vacuum the confined chamber to a predetermined low pressure value; placing the second substrate on a top of the first substrate; pressing to the second...