US Patent Issued to SKY TECH on Sept. 2 for "Plate cooling device and de-bonding station with plate cooling device" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,403,685, issued on Sept. 2, was assigned to SKY TECH INC. (Hsinchu, Taiwan).

"Plate cooling device and de-bonding station with plate cooling device" was invented by Jung-Hua Chang (Hsinchu County, Taiwan) and Ta-Hao Kuo (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plate cooling device for cooling carrier plate of a wafer, includes a cooling plate and a plurality of contact pads. The cooling plate includes an upper surface; wherein the upper surface is provided with a cooling area for placing the wafer thereon. The contact pads are disposed on the upper surface. The contact pads protrude on the upper surface, and the total are...