US Patent Issued to Skorpios Technologies on Oct. 14 for "Heterogeneous bonding for photonic integration" (Illinois, New Mexico Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,723, issued on Oct. 14, was assigned to Skorpios Technologies Inc. (Albuquerque, N.M.).

"Heterogeneous bonding for photonic integration" was invented by Stephen B. Krasulick (Albuquerque, N.M.) and John Dallesasse (Geneva, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the o...