ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,873, issued on Jan. 27, was assigned to SK SILTRON Co. LTD. (Gyeongsangbuk-Do, South Korea).
"Device and method for separating wafers" was invented by Se Ah Oh (Gumi-si, South Korea), Je Hyung Seo (Gumi-si, South Korea) and Kee Yun Han (Gumi-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a device for separating wafers sheet by sheet from ingot blocks having a plurality of sliced wafers bonded thereto. The wafer separation device includes a water tank configured to receive the ingot blocks and a liquid, a heating member configured to heat the liquid, a barrier rib provided in the water tank to isolate the ingot blocks fro...