US Patent Issued to SK SILTRON on April 29 for "Single wafer-type wafer cleaning device and method for controlling surface roughness of wafer using same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,699, issued on April 29, was assigned to SK SILTRON Co. LTD. (Gyeongsangbuk-do, South Korea).

"Single wafer-type wafer cleaning device and method for controlling surface roughness of wafer using same" was invented by Gun Ho Lee (Gyeongsangbuk-do, South Korea), Chi Bok Lee (Gyeongsangbuk-do, South Korea), Dae Ki Seo (Gyeongsangbuk-do, South Korea) and Byeong Ha Ko (Gyeongsangbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention presents a single wafer-type wafer cleaning device and a single wafer-type method for controlling the surface roughness of a wafer, in which, in a wafer cleaning process, mutually different cl...