US Patent Issued to SK SILTRON on April 29 for "Automatic abrasion compensation system of lower plate and wafer lapping apparatus having the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,841, issued on April 29, was assigned to SK SILTRON Co. LTD. (Gyeongsangbuk-do, South Korea).

"Automatic abrasion compensation system of lower plate and wafer lapping apparatus having the same" was invented by Jae Pyo Lee (Gumi-si, South Korea), Seong Cheol Jeong (Gumi-si, South Korea) and In Joon Jung (Gumi-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are an automatic abrasion compensation system of a lower plate and a wafer lapping apparatus having the same. The automatic abrasion compensation system reduces wafer misloading and errors in wafer loading inspection occurring when the distance between the lower plate and a ...