US Patent Issued to SK Innovation, SK ie technology on Sept. 9 for "Diamine compound, polyimide precursor and polyimide film using the same, and use thereof" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,281, issued on Sept. 9, was assigned to SK Innovation Co. Ltd. (Seoul, South Korea) and SK ie technology Co. Ltd. (Seoul, South Korea).

"Diamine compound, polyimide precursor and polyimide film using the same, and use thereof" was invented by Joo Hyun Lee (Daejeon, South Korea), Sang Yoon Park (Daejeon, South Korea) and So Young Lee (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided a diamine compound, a polyimide precursor and a polyimide film using the same, and a use thereof. The diamine compound may be very useful as a monomer for manufacturing a polyimide film having excellent transparency, high heat resistance, and ...