US Patent Issued to SK hynix on Sept. 9 for "Buffer chip, and semiconductor package including buffer chip and memory chip" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,618, issued on Sept. 9, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Buffer chip, and semiconductor package including buffer chip and memory chip" was invented by Choung Ki Song (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A buffer chip includes a control signal transmission path that transmitting, to a memory chip, control signals transmitted from a memory controller; a data transmission path including a variable delay circuit having a delay value adjusted by a delay code and transmitting, to the memory controller, data transmitted from the memory chip; a ring oscillator generating a ring oscillator clock; a c...