US Patent Issued to SK hynix on Oct. 7 for "Buffer chip, semiconductor package including buffer chip and memory chip, operation method of buffer chip, and operation method of semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,803, issued on Oct. 7, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).

"Buffer chip, semiconductor package including buffer chip and memory chip, operation method of buffer chip, and operation method of semiconductor package" was invented by Geon Ko (Gyeonggi-do, South Korea) and Choung Ki Song (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An operation method of a buffer chip may include receiving first control signals for setting a first memory chip; buffering the first control signals and transmitting the buffered signals to the first memory chip; storing a setting value of the first memory chip in response to t...