US Patent Issued to SK hynix on Oct. 28 for "Integrated circuit chip and die test without cell array" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,536, issued on Oct. 28, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Integrated circuit chip and die test without cell array" was invented by Ji-Hwan Kim (Seoul, South Korea) and Sang-Muk Oh (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit chip includes a first through electrode and a second through electrode formed through the integrated circuit chip, a transmission circuit suitable for selecting one of signals transmitted through the first and second through electrodes, respectively, and transmitting the selected signal to a data line, in response to a selection signal, and a selection sign...