US Patent Issued to SK hynix on Oct. 21 for "Semiconductor device having a redistribution bonding interconnection, a method of manufacturing the semiconductor device, and a chip stack package including the semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,467, issued on Oct. 21, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Semiconductor device having a redistribution bonding interconnection, a method of manufacturing the semiconductor device, and a chip stack package including the semiconductor device" was invented by Si Yun Kim (Icheon-si, South Korea), Kang Hun Kim (Icheon-si, South Korea) and Jun Yong Song (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a chip body; a circuit layer over the chip body; an upper insulating layer over the circuit layer; a chip metal layer over the upper insulating layer, the chip metal layer including...