US Patent Issued to SK hynix on Oct. 14 for "Semiconductor package including stacked semiconductor chips" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,708, issued on Oct. 14, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Semiconductor package including stacked semiconductor chips" was invented by Jong Joo Lee (Icheon-si, South Korea) and Kyeong Min Kim (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include: a substrate having a first side and a second side on a same plane; a first semiconductor chip disposed over the second side of the substrate; a first one-side third semiconductor chip stack disposed over the first side of the substrate and spaced apart from the first semiconductor chip; a second semiconductor chip stack disposed ove...