US Patent Issued to SK hynix on Nov. 18 for "Method of manufacturing a semiconductor device including a conductive line" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,801, issued on Nov. 18, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Method of manufacturing a semiconductor device including a conductive line" was invented by Jae Man Yoon (Icheon-si, South Korea), Jun Ki Kim (Icheon-si, South Korea), Tae Kyun Kim (Icheon-si, South Korea), Jung Woo Park (Icheon-si, South Korea) and Jae Won Ha (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes: forming a trench in an insulating interlayer by etching the insulating interlayer; forming a conductive layer on bottom, side, and upper surfaces of the insulating interlayer where the ...