US Patent Issued to SK hynix on March 4 for "Stack package including core die stacked over a controller die" (South Korean Inventor)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,853, issued on March 4, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Stack package including core die stacked over a controller die" was invented by Bok Kyu Choi (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stack package includes a core die disposed over a package substrate, and a controller die disposed between the core die and the package substrate to control the core die. The core die includes banks each including memory cell arrays, an interbank region in which row decoders and column decoders are arranged, and a pad region in which first connection pads electrically connected to the row decoders and colum...