ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,198, issued on March 25, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).
"Semiconductor device and method for fabricating the same" was invented by Jun Hyuk Seo (Gyeonggi-do, South Korea) and Myoung Sik Chang (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor device includes: forming a mold structure including a mold layer and a supporter layer over a semiconductor substrate; forming an opening penetrating the mold structure; forming a protective layer on a bottom surface and a sidewall of the opening; forming a lower electrode over the protective layer; selectively etching th...