ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,538, issued on March 25, was assigned to SK hynix Inc. (Icheon-si, South Korea).
"Semiconductor device and manufacturing method of the semiconductor device" was invented by Jae Hyoung Lee (Icheon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes forming a first stack, forming a sacrificial structure and a first contact passing through the first stack, forming a second stack on the first stack, forming a first hole through the second stack to expose the sacrificial structure, forming a second hole through the first stack by removing the sacrificial structure, forming a channel st...