US Patent Issued to SK hynix on March 18 for "Semiconductor package including heat dissipation layer" (South Korean Inventor)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,183, issued on March 18, was assigned to SK hynix Inc. (Icheon-si, Japan).

"Semiconductor package including heat dissipation layer" was invented by Joo Wan Hong (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes an interposer including first and second surfaces opposite to each other. The semiconductor package also includes a heat dissipation layer disposed on the first surface of the interposer and a first semiconductor die mounted on the first surface of the interposer. The semiconductor package additionally includes a stack of second semiconductor dies mounted on the second surface of the inte...