ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,083, issued on March 18, was assigned to SK hynix Inc. (Icheon-si, South Korea).
"Semiconductor die pickup apparatus" was invented by Jae Yeong Jung (Icheon-si, South Korea) and Jong Kyu Moon (Icheon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die pickup apparatus according to an aspect of the present disclosure includes a tape peeler for peeling a mount tape from a semiconductor die, and a flipper for holding the semiconductor die, wherein the tape peeler includes a housing part having a groove that faces the mount tape, a cover part covering the groove, a roller part connected to the cover part, and a vacuum par...