US Patent Issued to SK hynix on March 18 for "Semiconductor devices including substrates bonded to each other and methods for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,126, issued on March 18, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Semiconductor devices including substrates bonded to each other and methods for fabricating the same" was invented by Mi Seon Lee (Icheon-si, South Korea), Sung Kyu Kim (Icheon-si, South Korea) and Jong Hoon Kim (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "There are provided a semiconductor and a method of fabricating the same. The semiconductor device may include a second semiconductor substrate directly bonded to a first semiconductor substrate. The first semiconductor substrate may include a first through via with an end portion protruding...