US Patent Issued to SK hynix on June 3 for "Semiconductor chip including through electrode, and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,681, issued on June 3, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Semiconductor chip including through electrode, and semiconductor package including the same" was invented by Seung Hwan Kim (Icheon-si, South Korea), Hyun Chul Seo (Icheon-si, South Korea), Hyeong Seok Choi (Icheon-si, South Korea) and Moon Un Hyun (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip includes a body part having a front surface and a rear surface, a plurality of through electrodes penetrating the body part and arranged in a first direction in an array region, a plurality of front surface connection electrodes respect...