US Patent Issued to SK hynix on June 3 for "Memory package and a memory module including the memory package" (South Korean Inventor)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,436, issued on June 3, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).

"Memory package and a memory module including the memory package" was invented by Won Ha Choi (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A single memory package includes a package substrate; at least one of a memory chip and a buffer chip mounted on the package substrate; MxN number of interface data channel buses between the memory chip and the buffer chip; and (MxN)/2n number of outer data channel buses connected to the buffer chip. The buffer chip receives data from the memory chip through the interface data channel buses, and provides th...