US Patent Issued to SK hynix on June 10 for "Semiconductor chip including through electrode, and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,779, issued on June 10, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Semiconductor chip including through electrode, and semiconductor package including the same" was invented by Ho Young Son (Icheon-si, South Korea), Sung Kyu Kim (Icheon-si, South Korea) and Mi Seon Lee (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip may include: a body portion with a front surface and a rear surface; a pair of through electrodes penetrating the body portion; an insulating layer disposed over the rear surface of the body portion and the pair of through electrodes; and a rear connection electrode disposed over ...