US Patent Issued to SK hynix on July 22 for "Semiconductor packages including dam patterns and methods for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,134, issued on July 22, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Semiconductor packages including dam patterns and methods for manufacturing the same" was invented by Shin Young Park (Icheon-si, South Korea) and Dong Hyun Kim (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a semiconductor package and a manufacturing method thereof. Semiconductor chips may be disposed on a package substrate with vent holes formed therethrough, and a molding layer including a lower molding portion connected to an upper molding portion may be formed. The package substrate may include a substrate body with a plurality...