US Patent Issued to SK hynix on July 15 for "Three-dimensional semiconductor device and method of manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,900, issued on July 15, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Three-dimensional semiconductor device and method of manufacturing the same" was invented by Sung Wook Jung (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional (3D) semiconductor device includes a plurality of stack structures, a plurality of channel plugs, a slit structure and a plurality of dummy channel plugs. The stack structures include at least two conductive layers and at least two insulation layers, each being alternately stacked. The channel plugs are vertically formed through the stack structure. The slit structure is arr...