US Patent Issued to SK hynix on Jan. 13 for "Semiconductor package including stacked semiconductor chips" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,598, issued on Jan. 13, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Semiconductor package including stacked semiconductor chips" was invented by Ju Il Eom (Icheon-si, South Korea) and Seung Yeop Lee (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate; a sub semiconductor package disposed over the substrate, the sub semiconductor package including a sub semiconductor chip with chip pads on its active surface that faces the substrate, a sub molding layer that surrounds side surfaces of the sub semiconductor chip, the sub molding layer with a surface that faces the substrate, ...