ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,560, issued on Jan. 13, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).
"Semiconductor device including bonding pad" was invented by Byung Ho Lee (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a lower semiconductor structure including a plurality of first lower electrode bonding pads, a plurality of second lower electrode bonding pads, and a lower connection pattern connecting the plurality of first lower electrode bonding pads to each other while being connected to a first voltage; and an upper semiconductor structure disposed over the lower semiconductor structure and including a...