US Patent Issued to SK hynix on Jan. 13 for "Semiconductor device including bonding pad" (South Korean Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,695, issued on Jan. 13, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).

"Semiconductor device including bonding pad" was invented by Hee Sun Lee (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a lower semiconductor structure including one or more first lower test pads, one or more second lower test pads that are alternately arranged with the one or more first lower test pads, and a lower test terminal that is electrically connected to the second lower test pad through a second lower test line; and an upper semiconductor structure positioned over the lower semiconductor structure and...