US Patent Issued to SK hynix on Feb. 25 for "Semiconductor package including connection pad including groove pattern" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,251, issued on Feb. 25, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Semiconductor package including connection pad including groove pattern" was invented by Si Yun Kim (Icheon-si, South Korea), Kang Hun Kim (Icheon-si, South Korea) and Jun Yong Song (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a connection pad including a recessed portion disposed on one surface of the package substrate, and an insulating pattern disposed on the one surface of the package substrate to be spaced apart from the connection pad. The connection pad includes an outer sidewall, an ...