US Patent Issued to SK hynix on April 29 for "Semiconductor device including re-distribution pads disposed at different levels and a method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,761, issued on April 29, was assigned to SK hynix Inc..

"Semiconductor device including re-distribution pads disposed at different levels and a method of manufacturing the same" was invented by Jun Yong Song (Icheon-si, South Korea), Kang Hun Kim (Icheon-si, South Korea) and Si Yun Kim (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a chip body; a passivation layer on the chip body; a lower dielectric layer on the passivation layer; a first re-distribution pad on the lower dielectric layer; an upper dielectric layer on the lower dielectric layer, the upper dielectric layer having a groove that ex...