US Patent Issued to SK Hynix NAND Product Solutions on Oct. 14 for "Loading frame for high I/O count packaged semiconductor chip" (Oregon, Washington, Arizona Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,664, issued on Oct. 14, was assigned to SK Hynix NAND Product Solutions Corp. (Rancho Cordova, Calif.).

"Loading frame for high I/O count packaged semiconductor chip" was invented by Jeffory L. Smalley (Olympia, Wash.), Mohanraj Prabhugoud (Hillsboro, Ore.), Steven A. Klein (Chandler, Ariz.) and Mengqi Liu (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes a loading frame for mounting a packaged semiconductor chip and a heat sink for the packaged semiconductor chip to a socket. The loading frame is comprised of metal. The loading frame has at least one frame leg where the metal is folded...