ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,591, issued on April 1, was assigned to SK hynix NAND Product Solutions Corp. (Rancho Cordova, Calif.).
"Choked flow cooling" was invented by Mark Forsnes (Folsom, Calif.), Yuhong Cai (Folsom, Calif.), Florence Pon (Folsom, Calif.) and Yi Xu (Folsom, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages with chocked flow cooling. In an embodiment, an electronic package may comprise a package substrate, a die electrically and mechanically coupled to the package substrate, and a lid over the die. In an embodiment, the lid has a first opening and a second opening that is opposite from the first o...