US Patent Issued to SK enpulse on Oct. 14 for "Semiconductor process polishing composition and polishing method of substrate applied with polishing composition" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,611, issued on Oct. 14, was assigned to SK enpulse Co. Ltd. (Pyeongtaek-si, South Korea).

"Semiconductor process polishing composition and polishing method of substrate applied with polishing composition" was invented by Seung Chul Hong (Suwon-si, South Korea), Deok Su Han (Suwon-si, South Korea), Hwan Chul Kim (Suwon-si, South Korea), Han Teo Park (Suwon-si, South Korea) and Hyeong Ju Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor process polishing composition, and a polishing method of a substrate applied with a polishing composition are provided. The process provides a polishing composition improved in t...