US Patent Issued to SK enpulse on Oct. 14 for "Polishing composition for semiconductor processing polishing composition preparation method, and semiconductor device manufacturing method to which polishing composition is applied" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,616, issued on Oct. 14, was assigned to SK enpulse Co. Ltd. (Gyeonggi-do, South Korea).

"Polishing composition for semiconductor processing polishing composition preparation method, and semiconductor device manufacturing method to which polishing composition is applied" was invented by Han Teo Park (Seoul, South Korea), Deok Su Han (Seoul, South Korea), Jang Kuk Kwon (Seoul, South Korea) and Seung Chul Hong (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a polishing composition for a semiconductor process, a method of preparing the polishing composition, and a method of fabricating a semiconductor ...