US Patent Issued to SK enpulse on Oct. 14 for "Composition for semiconductor processing and polishing method of semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,911, issued on Oct. 14, was assigned to SK enpulse Co. Ltd. (Pyeongtaek-si, South Korea).

"Composition for semiconductor processing and polishing method of semiconductor device using the same" was invented by Deok Su Han (Seoul, South Korea), Seung Chul Hong (Seoul, South Korea), Han Teo Park (Seoul, South Korea), Hwan Chul Kim (Seoul, South Korea) and Hyeong Ju Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composition for semiconductor processing, includes abrasive particles surface-modified with an amino silane-based compound; a copper erosion inhibitor, including an azole-based compound; a copper surface protectant, inc...