US Patent Issued to SK ENPULSE on March 25 for "Polishing pad and method of fabricating semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,460, issued on March 25, was assigned to SK ENPULSE Co. LTD. (Gyeonggi-Do, South Korea).

"Polishing pad and method of fabricating semiconductor device using the same" was invented by Eun Sun Joeng (Gyeonggi-do, South Korea), Jong Wook Yun (Seoul, South Korea), Jang Won Seo (Seoul, South Korea), Yong Ju Jeong (Gyeonggi-do, South Korea) and Seung Kyun Kim (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a polishing pad including a polishing layer, wherein the nuclear magnetic resonance (NMR) 13C spectrum of a processed composition prepared by adding 1 g of the polishing layer to a 0.3 M aqueous solution of potassiu...