US Patent Issued to SK ENPULSE on March 11 for "Polishing pad and method of fabricating semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,246,408, issued on March 11, was assigned to SK ENPULSE Co. LTD. (Gyeonggi-do, South Korea).

"Polishing pad and method of fabricating semiconductor device using the same" was invented by Eun Sun Joeng (Gyeonggi-do, South Korea), Jong Wook Yun (Seoul, South Korea) and Jang Won Seo (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an endpoint detection window of a polishing pad for use in a polishing process. The polishing pad may prevent an error in detection of the endpoint of the polishing process by preventing a difference in endpoint detection performance from occurring due to a difference in the wa...