US Patent Issued to SK ENPULSE on July 15 for "Polishing pad and method for preparing semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,232, issued on July 15, was assigned to SK ENPULSE Co. LTD. (Gyeonggi-do, South Korea).

"Polishing pad and method for preparing semiconductor device using the same" was invented by Jong Wook Yun (Gyeonggi-do, South Korea), Hyeyoung Heo (Gyeonggi-do, South Korea), Jaein Ahn (Gyeonggi-do, South Korea) and Kyung Hwan Kim (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a polishing pad, a process for preparing the same, and a process for preparing a semiconductor device using the same. In the polishing pad, the surface zeta potential and its ratio of the polishing surface are controlled to specific ...