US Patent Issued to SK enpulse on Jan. 13 for "Composition for semiconductor processing and manufacturing method of semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,522,749, issued on Jan. 13, was assigned to SK enpulse Co. Ltd. (Pyeongtaek-si, South Korea).

"Composition for semiconductor processing and manufacturing method of semiconductor device using the same" was invented by Seung Chul Hong (Seoul, South Korea), Kangsik Myung (Seoul, South Korea), Han Teo Park (Seoul, South Korea), Deok Su Han (Seoul, South Korea) and Yongsoo Choi (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composition for semiconductor processing includes abrasive particles, and a dishing control additive, comprising a first dishing control additive and a second dishing control additive. The first dishing control addit...