US Patent Issued to SK enpulse on Dec. 2 for "Polishing pad and method for manufacturing semiconductor device using same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,428, issued on Dec. 2, was assigned to SK enpulse Co. Ltd. (Gyeonggi-do, South Korea).

"Polishing pad and method for manufacturing semiconductor device using same" was invented by Seung Chul Hong (Seoul, South Korea), Deok Su Han (Seoul, South Korea), Han Teo Park (Seoul, South Korea), Kyu Hun Kim (Gyeonggi-do, South Korea), Eun Sun Joeng (Gyeonggi-do, South Korea), Jang Kuk Kwon (Seoul, South Korea) and Hyeong Ju Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a polishing composition for a semiconductor process comprising abrasive particles, the abrasive particles containing an amine-based polishing rate improver, ...