US Patent Issued to SJ Semiconductor(Jiangyin) on Feb. 10 for "Chip packaging structure and method for manufacturing same" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,740, issued on Feb. 10, was assigned to SJ Semiconductor(Jiangyin) Corp. (JiangSu, China).

"Chip packaging structure and method for manufacturing same" was invented by Chengchung Lin (Jiangyin, China) and Jin Yang (Jiangyin, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip packaging structure and a method for manufacturing are disclosed, including a semiconductor chip, a device layer, and a warpage compensation layer, which is bonded to the device layer. The warpage compensation layer has a thermal expansion coefficient matching that of the semiconductor chip, the mismatch in coefficients of thermal expansion between the substrate and the...