US Patent Issued to Sivers Wireless on April 29 for "Arrangement comprising an integrated circuit package and a heatsink element" (Swedish, Pakistani Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,757, issued on April 29, was assigned to Sivers Wireless AB (Sweden).

"Arrangement comprising an integrated circuit package and a heatsink element" was invented by Erik Ojefors (Kista, Sweden), Dragos Dancila (Uppsala, Sweden), Imran Aziz (District Gujrat, Pakistan) and Johanna Hanning (Kista, Sweden).

According to the abstract* released by the U.S. Patent & Trademark Office: "An arrangement (100) is provided. The arrangement comprises an integrated circuit package (2). The integrated circuit package comprises a first side (2a) which comprises interconnect elements, and a second side (2b) which is opposite to the first side (2a). The integrated circuit package further comprises at...