ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,470, issued on June 17, was assigned to Sitronix Technology Corp. (Hsinchu County, Taiwan).
"Chip packaging structure and related inner lead bonding method" was invented by Ying-Chen Chang (Hsinchu County, Taiwan), Po-Chi Chen (Hsinchu County, Taiwan) and Kuo-Wei Tseng (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip packaging structure includes a chip and a film substrate. The chip is formed with a gold bump, and the film substrate is formed with an inner lead, wherein the gold bump includes a first bonding surface and a plurality of side walls. The gold bump is electrically connected to the inner lead through a eutecti...