US Patent Issued to SILTRONIC on May 27 for "Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes" (German, South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,455, issued on May 27, was assigned to SILTRONIC AG (Munich).

"Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes" was invented by Axel Beyer (Seoul, South Korea), Patrick Berger (Freiberg, Germany), Wolfgang Dietz (Dresden, Germany), Carl Frintert (Muehldorf am Inn, Germany) and Matthias Guenther (Freiberg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bear...