ALEXANDRIA, Va., June 17 -- United States Patent no. 12,313,578, issued on May 27, was assigned to Siltronic AG (Munich).
"Method for producing semiconductor wafers" was invented by Michael Boy (Waging am See, Germany), Ludwig Koester (Burghausen, Germany), Elena Soyka (Emmerting, Germany) and Peter Storck (Burghausen, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "Suitability of silicon wafers for use in device processing without generation of fatal defects is assessed by using SIRD to measure stress in a wafer cut from a piece of a crystal ingot after first and second thermal treatments of the water, the second thermal treatment consisting of a heating phase, a holding phase, and a cooling phase. T...