US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Sept. 9 for "Electronic structure having first and second thermal conductive materials covering conductive bumps and manufacturing method thereof, and electronic package having electronic structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,869, issued on Sept. 9, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic structure having first and second thermal conductive materials covering conductive bumps and manufacturing method thereof, and electronic package having electronic structure and manufacturing method thereof" was invented by Yi-Ling Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package and a manufacturing method thereof are provided, where the manufacturing method is to dispose an electronic structure with a plurality of conductive bumps and a thermal conductor on its upper surface on a carrier struc...