US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Sept. 9 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,819, issued on Sept. 9, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Yi-Min Fu (Taichung, Taiwan), Chi-Ching Ho (Taichung, Taiwan), Cheng-Yu Kang (Taichung, Taiwan) and Yu-Po Wang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit stru...